Sony Introduces 25Gbps/ch Short reach for optical communication module

by Sony Pro Team 03/15/2016, in Press, Sony Professional

Sony has established mass-production technology of an optical communication module for data center networks. Sony has developed this high-speed interface for transmitting large-data, high-resolution images. The company will exhibit this technology and product (QSFP28, 100G) at OFC2016 to be held in Anaheim, California from March 22, 2016.  The technology is planned to be available in the first half of 2016.

Fig.1 Example of the optical communication module using the Sony's unique semiconductor packaging technology

Fig.1 Example of the optical communication module using the Sony’s unique semiconductor packaging technology

 

For the cloud computing market, which is moving toward high-speed, large-data in the future, Sony will apply its technical innovation of optical communication module using the semiconductor packaging process that have been refined as the transmission technology of large-data, high-resolution images ( Figure 1). Sony will continue to expand its line-up of optical communication module for data center network application.

Main underlying technology

  • VCSEL/PD

Sony has deployed semiconductor laser technology, developed through many years of production experience with red, and blue laser technology, to the communication laser. Sony has successfully developed broadband and high reliability of the VCSEL/PD to realize the transmission of 25Gbps, and has achieved mass production introduced for the optical communication module.

Characteristics of VCSEL

–      High-temperature operation reliability test (HTOL: 78 ℃, 7mA): Clear 5000h

–      High reliability of the cumulative failure rate of 0.1% : 60yrs

Fig.2 25Gps 4channel array VCSEL

Fig.2 25Gps 4channel array VCSEL

 

Fig.3 Aging curve at high-temperature operation (HTOL:78℃, 7mA)

Fig.3 Aging curve at high-temperature operation (HTOL:78℃, 7mA)

 

Fig.4 Cumulative failure rate per channel (converted to 78℃, 7mA)

Fig.4 Cumulative failure rate per channel (converted to 78℃, 7mA)

 

Characteristics of PD

–      Compatibility of the large-diameter active area and the high-frequency characteristics (the active area size : φ40um, capacitance : 0.11pF,responsivity : 0.57A / W.typ)

 

Fig.5 25Gbps 4channel array PD

Fig.5 25Gbps 4channel array PD

 

Fig.6 Frequency response of PD

Fig.6 Frequency response of PD

 

  • Module

Sony optical communication module is produced by a Sony group which covers the process of assembly, packaging and testing, to realize the technological innovation to achieve the stable supply and high quality. Sony has completed the development of 25Gbps x 4ch of QSFP28 Transceiver with two-way communication using Sony’s unique semiconductor packaging technology, planned to be available in the first half of 2016.

Fig.7 QSFP28 Transceiver

Fig.7 QSFP28 Transceiver

 

Characteristics of Module

–      100Gbase-SR4 compliance

–      Power supply : 3.3V single

–      driving ambient temperature ( the top of the module case temperature specified ): Tc = 0 ℃ ~ 70 ℃

Fig.8 QSFP28 Transceiver Block Diagram

Fig.8 QSFP28 Transceiver Block Diagram

 

Fig.9 Optical output Eye Diagram (Tc=70℃)

Fig.9 Optical output Eye Diagram (Tc=70℃)

 

Product Line-up Roadmap

In addition to the above-mentioned QSFP28 Transceiver, 10Gbps/ch products are also scheduled to be released. Sony will continue to expand its lineup of optical communication module products with Sony’s unique packaging technology.

 

Product name MSA Supporting

distance

Actual Maximum Power Consumption Status
10Gbps/ch CXN2100 QSFP+ 100m(OM3) 0.76W In Production
CXN2102 QSFP+ 100m(OM3) 0.56W Now Sampling
CXN2103 QSFP+ 300m(OM3) 0.56W Now Sampling
CXN2200 CXP-AOC Up to 20m

(Negotiable)

2.7W/Module In Production
25Gbps/ch CXN2104 QSFP28 70m(OM3) 2.7W Now Sampling
CXN2201 QSFP28-AOC Up to 20m

(Negotiable)

2.7W/Module Sampling in 2Q16
CXN2106 SFP28 70m(OM3) TBD Sampling in 1Q17